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Printed wiring boards may be classified into two basic categories, based on the way they are manufactured: 1. Graphical 2. Discrete-wire

The two mode switches have four possible settings: speed1, speed2, speed3, or readout. Set the two mode switches to select the appropriate record speed (speed1, speed2, or speed3), press the reset button and let go. The circuit starts logging temperature.

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5.4.1 Graphical Interconnection Board A graphical PWB is the standard PWB and the type that is usually thought of when PWBs are discussed. In this case, the image of the master circuit pattern is formed photographically on a photosensitive material, such as treated glass plate or plastic film. The image is then transferred to the circuit board by screening or photoprinting the artwork generated from

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the master. Due to the speed and economy of making master artwork by laser plotters, this master can also be the working artwork. Direct laser imaging of the resist on the PWB can also be used. In this case, the conductor image is made by the laser plotter, on the photoresistive material, which is laminated to the board, without going through the intermediate step of creating a phototool. This tends to be somewhat slower than using working artwork as the tool and is not generally applied to mass production. Work continues on faster resists, as well as exposure systems, and this method will undoubtedly continue to emerge.

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Discrete-Wire Boards Discrete-wire boards do not involve an imaging process for the formation of signal conductors. Rather, conductors are formed directly onto the wiring board with insulated copper wire. Wire-wrap and Multiwire are the best known discrete-wire interconnection technologies. Because of the allowance of wire crossings, a single layer of wiring can match multiple conductor layers in the graphically produced boards, thus offering very high wiring density. However, the wiring process is sequential in nature and the productivity of discrete-wiring technology is not suitable for mass production. Despite this weakness, discrete-wiring boards are in use for some very high density packaging applications. See Fig. 5.2 for an example of a discrete-wiring board.

A further expansion of the preceding equations by assuming a parabolic pressure distribution from the slot to the end of the bearing and the presence of a constant pressure between two adjacent slots allows for the calculation of the load on the shaft as illustrated in Figure 755 for short bearings The strength of the inlet slot design lies in the introduction of air to the clearance around the circumference of the bearing that eliminates problems due to dispersion effect On the other hand, the effect of a non-axial flow reduces the load capacity

chip capacitors tend to be more fragile than the alumina body of a chip resistor The built-up layer structure of MLTF capacitors causes them to be particularly susceptible to both mechanical and thermal shock Chip capacitors use similar metal layers to build up the terminations that are soldered to the circuit board pad as were described previously for resistors Chip inductors are of two types as well Coil inductors are comprised of a fine Cu wire wound around the alumina body The body size and number of windings determine the part inductance The second type is the thin-film inductor The winding is fabricated from a patterned thin film, which is deposited upon a piece of alumina (Although the latter are considerably easier to fabricate, they have a limited range of inductance values) As much as 40 percent of passive components on a surface-mount product are chip capacitors.

The miniaturization of these devices is critical for reducing the size and weight of electronic products For handheld electronics (such as cell-phones, PDAs, and pagers), common capacitor sizes are from 0603 down to 0402 and 0201 Some diodes and all active devices come in a wide variety of peripheral lead and area-array packagesThe diodes and transistors are typically used in small-outline (SO) packages; they are the small-outline diode (SOD) and small-outline transistor (SOT) packagesThe package body is a plastic overmolding compound There are two leads for the SOD and three for the SOT The leads are very robust, have a gull-wing shape, and are formed from Cu or an Fe-based alloy Larger active devices require more I/Os These devices use the small-outline integrated circuit (SOIC) package with gull-wing leads protruding from the two sides of the long dimension.

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