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The gull-wing leads are very robust with a pitch of 127 mm (50 mil) or 0635 mm (20 mil) Pitch is the distance between the centerlines of two neighboring leads A further increase in the number of I/Os was realized by placing leads around all four sides of the package; the leads can have the gull-wing geometry or have the J-lead geometry The J-configuration reduces the bond pad area by bending the lead inward, under the package Like the gull-wing, the J-lead geometries are robust at 127 mm (50 mil) and 0635 mm (20 mil) pitches Pitches below 0635 mm, beginning with 05 mm and 04 mm pitches, are called fine-pitch (package) technology The smaller leads are considerably more fragile, causing them to be more susceptible to damage during handling and pick-and-place activities.

To read out the data, set the two mode switches to readout mode (both switches OFF), connect the logger to the PC serial port, and press the reset switch. The data logger dumps the data to the PC at 2400 baud, 8N1. A suitable terminal emulator program can save the data to a file for analysis or viewing.

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Also, the fine-pitch packages have a more stringent coplanarity requirement for the leads Coplanarity specifies the degree to which the lead bottoms must be at the same level around the periphery of the package A non-coplanar lead one that is lifted high is more likely to generate an open because of the reduced amount of solder used for these smaller I/Os A lead that is too low will be damaged during package placement and also displace the solder paste deposit, causing a defective joint or short circuit to a neighboring lead after the assembly step A second type of peripheral I/O package is the leadless ceramic chip carrier (LCCC) This package is made of ceramic material; the I/Os are castellations on all four sides of the package Solderability of the castellations is obtained by a Ni finish over which is deposited an Au layer.

The design of an aerostatic bearing involves matching the various load and stiffness requirements with bearing clearance, orifice design, air supply pressure and flow rate Table 72 provides some guidelines for the design of aerostatic journal bearings Relative values are given for each parameter It is found that two air bearings with feeding at the quarter station give the best performance in terms of load capacity, stiffness and angular stiffness However, the air flow rate is comparatively much higher Figure 741 shows the operation of work and grinding spindles in the Moore ultra-precision machine [29] Most of the air bearings in the work spindle from various manufacturers are almost similar in terms of performance and dimension The same can be said about the grinding spindle which is shown in Figure 742 It is found that there are different approaches to design the aerostatic journal bearing in either the work or the grinding spindle However, Powell s approach seems to be accurate and comprehensive Therefore, the design of an aerostatic journal bearing similar to those used in ultra-precision machines will be explained based on an example adapted from Design of Aerostatic Bearings by JW Powell [3] Example: Design of an Aerostatic Journal Bearing An air-lubricated journal bearing must be designed to carry a load of 100 lbf (445 N) at an eccentricity ratio of 05 Its radial stiffness should exceed 400,000 lbf/in (70,000 N/mm) A workshop airline is available at a 75 lbf/in2 (51675 kPa) gauge The airflow should not exceed 050 scfm (00142 m3/min)

The Ni and Au layers extend down the castellation and under the frame to form a pad This package can be used only on so-called matched or low-expansion substrates, that is, circuit board substrates with a thermal expansion coefficient that matches that of the ceramic package Otherwise, the solder joints are quickly degraded by thermal mechanical fatigue (TMF) when exposed to even modest cyclic temperature environments Area-array packages include the BGA, CSP, the land grid array (LGA), DCA/FC, and the ceramic column grid array (CCGA) The common characteristic of these packages is that the solder joint is made to an array of solderable pads on the bottom side of the package rather than to peripheral leads or castellationsThe difference between a BGA package and a CSP package is that the latter is stipulated to have molding compound dimensions that are less than 12 times the corresponding die dimension.

There are no specified limits on a BGA package size The typical pitch size is 127 mm and 10 mm for BGA and CSP packages Here, the pitch is the distance between the center points of any two balls or lands Therefore, alignment requirements are not very stringent for these area-array packages Also, there is a sufficient quantity of solder to allow self-alignment between the package and circuit board pads by the surface tension of the molten solder However, as ball counts reach several thousands, reduced ball.

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