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sizes and pitches are required, which in turn necessitate closer tolerances on part placement. This is also the case of DCA, where the solder ball size and pitches tend to be as small as 0.10 mm and 0.25 mm, respectively. The CCGA is a variant of the BGA in which the solder balls have been replaced with solder columns. The columns allow the ceramic package to be assembled to an organic laminate circuit board of considerably larger thermal expansion coefficient by absorbing the higher strains created by the larger thermal expansion mismatch between the two materials. The columns are created from one of the high-melting-temperature, Pb-based alloys (e.g., 95Pb5Sn or 90Pb-10Sn) that will not melt during a eutectic Sn-Pb reflow process. The columns may also have a Cu spiral wound around them to enhance durability as those columns are susceptible to damage during handling and part placement. The accelerated development of surface mount components has generated packages and I/O configurations that have not yet been standardize, resulting in odd-form devices. Examples of odd-form components include surface mount switches and connectors as well as a variety of inductors, (Fig. 40.13) LEDs, and transformers. Typically, so-called surface-mount connectors may actually be mixed technology with through holes providing the mechanical strength needed for cable insertion and removal activities and surface-mount leads establishing the electrical connection. (The through-hole interconnections can be made by paste-inhole techniques or be soldered manually.)

FIGURE 40.13 Odd-form components as exemplified by surface-mount inductors. (Courtesy of Sandia National Laboratories.)

Slocum s performance comparison of load, flow rate stiffness and tilt stiffness for typical journal bearing geometries and arrangements modified with station locations [1]

A number of assembly-related issues must be addressed with odd-form components. First, it is necessary that correct pad dimensions be designed on the circuit board. Also, the stencil must have the correct aperture size to print an adequate quantity of solder paste. The pickand-place machine may require custom tooling in order to handle these components. Lastly, odd-form parts are typically larger and heavier. Therefore, it is possible that they will not readily self-align while the solder is molten during the reflow process.

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A Swipe card contains bar-coded information as seen on many products. I propose to use an IR LED and detector to scan a bar-coded swipe card using AT90S1200 controller. The controller reads the swipe card and dumps the code onto a LCD display, a serial port, or it could be used to activate some valve/relay, etc. The swipe card idea is illustrated in Figure 20.5.

The conversion to Pb-free solders has significantly affected surface-mount components In the case of leadless passive devices and peripherally leaded packages, the traditional electroplated Sn-Pb finish has been replaced with 100 percent Sn coatings The Sn coatings have raised concerns regarding the development of Sn whiskers that can potentially short nearby conductors in service The Sn-Pb solder balls of BGA, CSP, and DCA technologies, having a melting temperature of 183 C, are being replaced with Sn-Ag-Cu alloys with a melting temperature of 217 C In the case of DCA/FC and CCGA applications, the high-Pb alloys used for the balls and columns, respectively, will not melt during a Sn-Ag-Cu solder process used to create the second-level interconnections 40332 Dispensing In surface-mount technology, three classes of materials must be dispensed on to the circuit board: adhesives, fluxes, and solder pastes.

Each of these three categories, which utilize very similar equipment options for the actual dispensing action, is discussed in the following subsections 403321 Adhesives Adhesives are used to secure surface-mount devices to the circuit board An adhesive may be required when, for example, exposing surface-mount components to a wave-soldering process used to assemble a mixed technology circuit board Also, larger components on double-sided circuit boards may be adhesively bonded in place to prevent them from falling off when the board is turned upside down for the second reflow step Under these circumstances, the package weight exceeds the surface tension force of the molten solder that keeps smaller components on the board The adhesive must be able to withstand the temperature conditions of the wave or reflow soldering process as well as the chemical activity of the flux.

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