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Adhesives may also be required to anchor larger surface-mount devices to the circuit board This additional strength is needed for service specifications that include mechanical shock and vibration environments (Adhesives are typically not used for through-hole components because clinching the leads provides a sufficient anchor to keep the component on to the board prior to and during the soldering process After soldering, through-hole solder joints are sufficiently robust to withstand heavy shock and vibration environments Nevertheless, in very severe environments, adhesives may be used to anchor through-hole components to the substrate) It is important to control the quantity of dispensed adhesive since there must be sufficient material to perform the attachment function On the other hand, too much adhesive can cause run-out onto the solder pad or component I/O, resulting in poor solderability.

Fig 741: Aerostatic work and grinding spindles in action [29]

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Some adhesives are prone to run-out or bleeding caused by their separation into individual liquid components that together comprise the adhesive material When bleeding by a component liquid occurs beyond of the adhesive deposit, that bleeding liquid can contaminate nearby solderable surfaces In the case of very dense circuit boards, excessive migration of the whole adhesive migration, or the bleeding of one of its components, can contaminate the pads of other components, affecting their placement and solderability Although the function of the adhesive is to anchor components in place for the soldering process, the adhesive deposit remains as a part of the assembly after soldering, and as such must not interfere with next-assembly steps or negatively impact the long-term reliability of the circuit board For example, some epoxies readily absorb moisture or other organic compoundsThose absorbed materials may outgas during subsequent temperature excursions that could contaminate critical surfaces (e.

g, sensors) when the product is in service Therefore, it is important to select only adhesive materials that are qualified for a particular application Adhesives materials that are used in electronics assembly processes are typically based upon epoxies or silicones Adhesives can also be described by the following four functional/materials categories: thermosetting adhesives, thermoplastic adhesives, elastomer adhesives, and toughened alloy adhesives Each group differs in its compositions, the type of curing cycle, and its pre- and post-cure material properties The curing cycle, which typically requires an elevated temperature/time profile, must not degrade the components present on the board or the laminate itself It is understood that the added step of a curing cycle slows the overall assembly process Thermosetting adhesives cure by heat or a catalytic reaction that cross-links the polymer chains Once cured, these materials remain very strong and will not readily soften at elevated.

temperatures Epoxies are one group of thermosetting adhesives, which are used widely in electronics assembly because they do not weaken at the high temperatures of wave and reflow soldering environments Also, epoxies are resistant to attack by solvents and aqueousbased cleaning solutions Epoxies can be one-part, in which the curing agent and resin are already mixed together, or two-part, in which the two chemistries are combined prior to application Although the one-part epoxies are convenient from the assembly standpoint, their storage and handling must be rigidly controlled to prevent curing prior to use Both epoxies are cured by exposure to elevated temperatures, which can range from less than 100 C to as high as 125 to 150 C, for time periods of 1 to 4 hours, depending on the specific product recommendations There is very little outgassing associated with the curing of thermosetting adhesives.

It is sometimes desirable to interface a PC/AT keyboard to a microcontroller for some applications. This project illustrates how to achieve just that. The diagram in Figure 20.6 illustrates the idea. The keyboard is connected to the AT90S2313 controller through connector J1. Only two lines are required: for the clock and data signals of the keyboard. These lines are bidirectional. During normal operation, the keyboard drives the clock and data lines; however, the controller can also take control of these lines to send commands to the keyboard.

Higher residual stresses can be generated by these materials due to their rigidity at elevated temperatures when there is a significant thermal expansion mismatch among the package, the epoxy, and the circuit board substrate The permanency of thermosetting adhesives complicates repair or rework functions The removal of these adhesives usually requires mechanical scraping and abrasion that can damage the component and circuit board Thermoplastic adhesives soften when exposed to elevated temperatures These adhesives are weaker than thermosetting epoxies However, when tolerances are less restrictive, these materials may be preferred for assembly applications, particularly when excessive residual stresses are of concern during the soldering process temperature cycle Thermoplastic materials are less resistant to solvents and aqueous-based materials These adhesives tend to absorb these liquids more readily, resulting in dimensional changes (swelling) and more outgassing than is observed with thermosetting adhesives.

A consideration of the manufacturing facilities available suggests that geometric errors may total to 00002 in (508 m) in relation to the diametrical clearance and holes down to 0005 in (0127 mm) diameter can be drilled The machine design limits the bearing diameter to 2 in (508 mm) but does

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